2024年4月22日

 
關於台灣花蓮地區賑災事宜

對於花蓮地區於2024年4月3日上午7點58分發生了

芮氏規模7.2地震造成的罹難者,我們深表哀悼。同時,我們

向受災者及相關人士致以誠摯的慰問。

 

Taiwan MJC為協助當地重建居民的家園、恢復居民的正常

生活及工作,承諾將善盡企業社會責任,我們已於4/22捐款

新台幣22萬元整,以支援受災者及家屬攜手渡過艱難時刻與恢復重建工作。

 

盼受災地區能盡快恢復舊貌。

What is a package probe (test socket)?

There are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips.
An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below).

Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use.

MJC provides two types of test sockets: the J-Contacts series and the BeeContacts series. Compared with conventional test sockets, these series offer higher-performance test sockets that excel in electrical characteristics, particularly high frequency characteristics and contact.
These test sockets are suitable for testing power devices and electrical parts for mobile communication and in-car devices, and are customizable according to the testing environment.

To differentiate its test sockets that probe LSI packages in a more advanced field of measurement than that of conventional products, MJC calls these “package probes.”

img_package_probe01

 
  • FPD Products

    FPD Products

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  • Probe Card

    Probe Card

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  • Wafer Prober

    Wafer Prober

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  • Tester

    Tester

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  • Test Socket

    Test Socket

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